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Yuan lei small class | on the application of low melting point glass powder.

Release time:

2024-01-29 09:38

 

Yuan lei small class | on the application of low melting point glass powder.

 

 

 

For low melting pointGlass powderThis new material, which has been applied in batches to high-temperature coatings, is divided into two categories:inorganic formulaandOrganic formula. Compared with the inorganic formula, the organic formula uses resin as the carrier, which limits its heat-resistant temperature. That is to say, the organic formula is only suitable for open flame at normal temperature and pressure over 600 degrees. If the temperature is higher, the resin inside will carbonize and lose its adhesion, thus causing the coating to fall off.

 

 

Usage: Basically, adding 150 degrees to the initial melting temperature of low melting point glass powder is its process temperature. The process temperature and time should be adjusted according to the thickness of the coating. The thick time is long and the thin time is short. For example:

1. For tempered glass, it is basically printed with 200 mesh screen, D245, D250 and even D255. The process time is D250 as an example. It needs to match the glass tempering time. The principle is 5 minutes to 19 minutes respectively. That is to say, the thickness of the glass directly affects the length of the process time, and the thickness of our coating also needs time to match.

2. It is the same for metal. What is the difference in the process when we do the same thickness coating on stainless steel, iron, aluminum and copper? For the same thickness, temperature and time are considered. The simplest difference is that copper is the most thermally conductive. When copper heats up, the faster it rises, the faster it conducts heat, and it is more difficult to achieve a higher temperature on its surface. Therefore, when it is used on copper surface, it requires higher temperature and time. Their thermal conductivity is different, followed by aluminum, followed by stainless steel, and iron has the worst thermal conductivity, therefore, the process temperature and time required for iron are relatively lower.

3, the second consideration is the expansion coefficient, the current low melting point glass powder can be matched to the corresponding expansion coefficient, is already mature batch application. Other inorganic fillers can also be added, but with other inorganic fillers, its thermal conductivity and heat capacity will be different. This is a deeper formulation problem.

 

 

2. organic formulaWith resin as the carrier, low melting point glass powder is only used as a functional filler lurking in this paint ink, which generally accounts for about 16-22% of the total composition of this formula. How should other processes be done or how should they be done. Figuratively speaking, low melting point glass powder is like an underground party lurking in it. I won't work if your temperature doesn't come. I can just be regarded as filling powder. For example, when the barbecue oven uses this D240, it does not work at about 400 degrees. When you ignite it, the flame temperature will reach about 650 degrees under normal temperature and pressure. If you add a little more time, the low melting point glass powder will start to melt, which will be the same as the resin free radical, and the flame retardant mechanism of plastic is the same.

 

 

When reacting with it, the temperature will start to drop as soon as the temperature drops, and it will agglomerate as soon as the temperature drops, forming an oxygen insulating layer, which will cut off the oxygen, so that the resin inside cannot react with the oxygen, while the resin inside is still attached to the metal without causing falling off, thus forming a protective layer to protect the resin from being burned. Therefore, this kind of general use open flame to burn, basically can be sure that its coating is black, because there is carbon in the resin, after high temperature carbonization into black!

 

 

 

 

 

 

 

Melting point, time, formula, temperature, resin, process, glass powder, organic, thermal conductivity

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