1. Crystalline silicon powder
Crystalline silicon powder is a silica powder material made of quartz block, quartz sand and other raw materials, through grinding, precision classification, impurity removal and other processes, with stable physical and chemical properties and reasonable and controllable particle size distribution.
Crystalline silicon powder can improve the physical properties of downstream related products in terms of linear expansion coefficient and electrical properties, and can be applied to copper clad laminates for household appliances such as air conditioners, refrigerators, washing machines and desktop computers. Epoxy plastic sealing materials used in switches, wiring boards, chargers, etc.; And electrical insulation materials, adhesives, coatings, ceramics and other fields. Some products of crystalline silicon powder are shown as follows:
2. Fused silica powder
Fused silica powder is made of fused quartz, glass and other materials as the main raw materials, and is produced through grinding, precision classification and impurity removal processes. It has the characteristics of high purity, high insulation, small linear expansion coefficient, low internal stress and excellent electrical properties.
Fused silica powder has high purity, low dielectric constant, dielectric loss and linear expansion coefficient, and is superior to crystalline silica powder in signal transmission speed, transmission quality and reliability of electronic products. It can be applied to copper clad laminates used in smart phones, automobiles, network communication and industrial equipment, and epoxy plastic packaging materials used in integrated circuit packaging such as air conditioners, washing machines, refrigerators, charging piles, photovoltaic modules, etc; and adhesives, coatings, ceramics, packaging materials and other fields. Some products of fused silica powder are shown as follows:
3. Spherical silica powder
Spherical silica powder is a spherical silica powder material processed by flame melting method with selected angular silica powder as raw material, which has excellent characteristics of small specific surface area, good fluidity and low stress.
Compared with angular silicon micropowder, spherical silicon micropowder has better surface fluidity and higher filling rate than angular silicon micropowder, which can significantly reduce the linear expansion coefficient of copper clad laminate and epoxy plastic sealing material and improve the reliability of electronic products. At the same time, spherical silicon micropowder can reduce the wear of equipment and molds during the manufacture of related products, and can be applied to high-end copper clad laminates such as aerospace, radar, supercomputer and 5G communication; smart phones, digital cameras, flat panel displays, central processing units, switches and other large-scale integrated circuit packaging epoxy plastic packaging materials; as well as high-end coatings, special ceramics, fine chemicals and other fields. Some products of spherical silica powder are shown as follows: